主要パラメータ
Main Optoelectronic Indicators
1. Linear mode parameters
Parameters | Test conditions（unless otherwise specified，TC =25±5℃) | Min | Max | Unit |
Effective detection surface diameter d | — | 25 | — | μm |
Spectral response range | — | 950 | 1650 | nm |
Reverse breakdown voltage VBR | IR=10 μA ，Φe=0 | 60 | 85 | V |
Responsivity Re | Φe=1μW，VR=(VBR-1)V, λ=1550 nm±50 nm | 8 |
| A/W |
Dark current ID | VDC =(VBR-1) V，Φe=0 |
| 1 | nA |
Capacitance Ctot | VDC =(VBR-1) V，f=1MHz | — | 0.2 | pF |
Breakdown voltage temperature coefficient η | TC =-45～+30℃ , IR =10μA，φe=0 | 0.10 | 0.2 | V/℃ |
2. Geiger Mode Parameters
Parameters | Test Conditions | Min | Max | Unit |
Single photon detection efficiency PDE | TA = -40±5℃, μ=1, fg = 1.0 GHz, fP = 500 kHz, DCR ≤ 2.5 kHz ，λ = 1.55μm | 10 |
| % |
Dark count rate DCR | TA = -40±5℃, fg = 1.0GHz， SPDE = 10%±0.5 % ，λ = 1.55μm |
| 2.5 | kHz |
After pulse probability APP (500 ns) | TA = -40±5℃, μ=1, fg = 1.0GHz, fP = 500 kHz, DCR ≤ 3.0 kHz, SPDE = 10% ，λ = 1.55μm |
| 4
| %
|
Time jitter TJ | SPDE=10% |
| 300 | ps |
Note: λ is the incident light wavelength, Tₐ is the test temperature value, μ is the average number of photons per pulse, fg is the gating signal frequency, and fₚ is the optical pulse signal frequency.
Absolute Maximum Ratings and Recommended Operating Conditions
Item | Parameter | Rating |
Absolute Maximum Ratings | 1 | Storage temperatureTSTG | -50℃~+85℃ |
2 | Operating environment temperatureTC | -50℃~60℃ |
3 | Soldering temperatureTsld（time） | 260℃（10s） |
4 | Reverse DC bias voltage VDC | VBR+5 V |
5 | Input optical powerφe（continuous） | 1 mW |
6 | Forward currentIF（continuous） | 200 μA |
7 | Electrostatic discharge sensitivityESD | ≥300 V |
8 | Pigtail pulling force | 3.0 N |
9 | TEC voltage | 11.9 V |
10 | TEC current | 0.8 A |
No. | Parameters | Rated value |
Recommended working conditions | 1 | APD chip operating temperature Tth | -50℃～-30℃ |
| 2 | Reverse DC bias voltage VDC | VBR+1V～VBR+5V |
Typical characteristic curve
Figure 1 Photocurrent and dark current curves
Figure 2 Breakdown voltage temperature coefficient
Quality reliability assurance
Implement the relevant requirements of GJB8119-2013 "General Specifications for Semiconductor Optoelectronic Devices"
寸法およびピン定義
Package Outline,Dimensions
Unit: mm
Figure 2 Product Outline
Product dimensions see Table 2
Symbol | Min. | Nominal | Max. | Symbol | Min. | Nominal | Max. | Symbol | Min. | Nominal | Max. |
H1 | 6.0 | - | 6.6 | L2 | 10.0 | - | 30.0 | L8 | 8.6 | - | 9.2 |
H2 | 0.8 | - | 1.2 | L3 | 4.0 | - | 4.6 | L9 | 12.4 | - | 13.0 |
H3 | 6.1 | - | 6.6 | L4 | 2.1 | - | 2.5 | L10 | 28.4 | - | 29.0 |
H4 | 9.1 | - | 10.5 | L5 | 21.7 | - | 22.3 | ф1 | 3.0 | - | 6.6 |
L0 | 1000.0 | - | - | L6 | 17.8 | - | 18.2 | Ф2 | 0.35 | - | 0.50 |
L1 | 13.2 | - | 13.8 | L7 | - | 2.54 | - | Ф3 | 2.2 | - | 2.6 |
Equivalent Circuit and Pin Definitions
Figure 4 Pin arrangement and numbering (top view)
PIN# | Function | PIN# | Function |
1 | APD_P | 5 | TEC- |
2 | Signal Sampling Port (OUT) | 6 | R_th |
3 | NC | 7 | R_th |
4 | APD_N | 8 | TEC+ |
TEC\NTC Electrical parameters
NTC (Thermistor): RT=10 kΩ @ 25℃, β=3450,5%.
TEC (Thermoelectric Cooler): IMAX=0.8 A, VMAX=11.9 V, THMAX=200℃
注文情報
If there are no special requirements, the fiber interface of the SPD6522Q device is G657A2 single-mode fiber (0.9mm tight-buffered protective tube), FC/UPC connector, and fiber length 1.0m, that is, the detailed order model is SPD6522Q.
If the fiber specifications, length, connector, etc. required for the ordered product are inconsistent with this product, please follow the following format:
Note:
● The product is an electrostatic sensitive device, and ESD protection must be taken during storage and use.
● The bending radius of the product fiber is not less than 30mm. Avoid fiber breakage and contamination or damage to the connector during storage and use.
● The product requires external refrigeration. The clamping carrier used for refrigeration needs to be made of a material with good thermal conductivity, keep the cavity wall at one end of the device lead and the contact surface of the clamping carrier tightly matched, and apply thermal conductive material on the contact surface of the two.
● The product should be stored in a clean environment with ventilation and no corrosive gas at a temperature of -10~+40℃ and a relative humidity of no more than 80%.
