パッケージサイズ
Outline Drawing
Note: The silk screen on the pictures is only for reference .
Absolute maximum ratings
Item | Unit | Min | Typ | Max |
Case Temperature | ℃ | -5 | 25 | 70 |
Chip Temperature | ℃ | +10 | 25 | 50 |
Operating Current | mA | 0 | 80 | 100 |
Forward Voltage | V | 0.8 | 1.2 | 2.0 |
Suggest TEC Current | A | - | - | 1.2 |
Reverse Voltage（LD） | V | - | - | 2.0 |
Reverse Voltage(PD) | V | - | - | 20 |
Note：
1.Stresses which exceed the absolute maximum ratings can cause permanent damage to the device.
2.These are only absolute stress ratings . Functional operation of the device is not implied at conditions exceeding those given in the operational sections of the data sheet.
3.Exposure to absolute maximum ratings for extended periods can affect device reliability adversely
Handling Procedures
1. Suggested bonding condition
● Bonding temperature: 350℃
● Bonding force: 30 grams (not exceed 40 grams)
● Bonding force and temperature should be applied in a gradual fashion
● Bonding time: <= 10 seconds
2. Suggested burn-in conditions
Conditions 1：
● Chip heatsink temperature: 100℃
● Current: 100mA
● Time: 24 hours
● Pass Criteria: BI 0hrs LIV1；BI 24hrs LIV2 Compare LIV2 to LIV1
● Delta Ith (T=25℃) ≤1mA and Delta Pf(T=25℃) ≤10%
Conditions 2：
● Chip heatsink temperature: 100℃
● Current: 100mA
● Time: 24 hours+48hrs
● Pass Criteria: BI 24hrs LIV1；BI 24hrs+48hrs LIV2 Compare LIV2 to LIV1
● Delta Ith (T=25℃) ≤0.7mA and Delta Pf(T=25℃) ≤5%
